LG denies any Snapdragon 810 heating issue on the G Flex 2

22 January, 2015

While there have been recent concerns over the heating issues of the Qualcomm Snapdragon 810 chipset, LG, who is using the same processor on its upcoming G Flex 2, doesn't seem to have any problem.

At a press event for the G Flex 2, LG vice president for mobile product planning Woo Ram-chan said "I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip's performance is quite satisfactory," and "I don't understand why there is an issue over heat."

The Snapdragon 810 heating issues that Ram-chan dismisses here were apparently severe enough for Samsung to abandon the 810 chipset for its upcoming Galaxy S6 and instead use its own Exynos processor only this time. We will have to wait and see if the heating issues are real or not when we test the G Flex 2.

Source

Samsung Android

Reader comments

Anonymous
05 Sep 2015
fD7

Heat sink is made of aluminum or copper pipe. It wont be flex and there is no room to install it. Just trash and get a new phone without headache.

mohsinj
28 Jul 2015
t@E

i lost my trust in Snapdragon after these rumors were actually true. if it was not true then why they are making a new version of the same chip, admit it and get back to work. Snapdragon is very overpriced, i think the flagship phone makers will no...