Lenovo reveals details about Legion Y70 cooling capabilities
Lenovo is introducing a Legion Y70 smartphone on August 18, and the company already revealed major specs of the new flagship. Today it continued with an array of teasers, revealing more about the phone’s cooling capabilities.
The company is going to introduce a massive 5,047 sq.mm VC cooling that’s just 0.55 mm thick. That’s right, the chamber will have a profile that’s half a millimeter.
Lenovo Legion Y70 is going to have an extremely thin profile in general - advertised is 7.99 mm, which is the base thickness without the protruding 50MP camera with OIS.
It will somehow manage to bring 10 layers of heat dissipating materials and solutions, and the phone is being advertised next to a fridge because obvious references are obvious.
As we can see, the new Legion smartphone wants to keep the gaming legacy of the sub-brand while keeping a friendlier look and feeling for the average consumer.
There will be no shoulder triggers or heavily modified UI for mobile gaming-oriented users but is still expected to keep the top performance with a Snapdragon 8+ Gen 1, 68W fast charging and up to 16 GB RAM.
Source (in Chinese)
- 28 Aug 2022
Legion y90 the best
- 16 Aug 2022
"liar liar pants on fire"
- 13 Aug 2022
it is just a heat conductor and it doesn't make your phone to get cool as freezer (of course if you play outside in winter/autumn) :(. ZTE Nubia is the only brand which applied the real cooling system feature.