MediaTek Dimensity 8300 brings Armv9 CPU, 60% faster GPU and Generative AI capabilities
MediaTek announced its latest 8000-series chipset with the Dimensity 8300. The new SoC is fabed on TSMC’s second-generation 4nm process and comes as a direct successor to last year’s Dimensity 8200 offering performance upgrades across the board.
Dimensity 8300 features 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz alongside 4x Arm Cortex-A510 efficiency units at up to 2.2GHz clock speeds. All eight cores are based on the Armv9 CPU architecture and MediaTek claims up to 20% faster CPU performance and 30% peak gains in power efficiency compared to the outgoing Dimensity 8200.
| Dimensity 8300 | Dimensity 8200 | Dimensity 8100 | |
| Node | 4 nm | 4 nm | 5 nm |
| CPU Prime | 1x Cortex-A715 @ 3.35 GHz | 1x Cortex-A78 @ 3.1 GHz | - |
| CPU Big | 3x Cortex-A715 @ 3.0 GHz | 3x Cortex-A78 @ 3.0 GHz | 4x Cortex-A78 @ 2.85 GHz |
| CPU Little | 4x Cortex-A510 @ 2.2 GHz | 4x Cortex-A55 @ 2.0 GHz | 4x Cortex-A55 @ 2.0 GHz |
| RAM | LPDDR5X (up to 8,533Mbps) | LPDDR5 (up to 6,400 Mbps) | LPDDR5 (up to 6,400 Mbps) |
| Storage | UFS 4.0 with MCQ | UFS 3.1 | UFS 3.1 |
| GPU | Mali-G615 (60% faster than 8200) | Mali-G610 MC6 | Mali-G610 MC6 |
| Display | FHD+ @ 180Hz, WQHD+ @ 120Hz | FHD+ @ 168 Hz, WQHD+ @ 120 Hz | FHD+ @ 180Hz, WQHD+ @ 120Hz |
| Camera (stills) | 320 MP | 320 MP | 200 MP |
| Camera (video) | 4K @ 60 fps (HDR10+) | 4K @ 60 fps (HDR10+) | 4K @ 60 fps (HDR10+) |
| 5G | 5.17 Gbps downlink | 4.7 Gbps downlink | 4.7 Gbps downlink |
| Wi-Fi | Wi-Fi 6E (2x2) | Wi-Fi 6E (2x2) | Wi-Fi 6E (2x2) |
| Bluetooth | 5.4 | 5.3 | 5.3 |
The new chip also boasts an Arm Mali-G615 MC6 GPU which brings up to 60% performance gains and 55% improved power efficiency at peak speeds compared to its predecessor. MediaTek is also claiming up to 17% faster app cold launch and up to 47% faster app launch from standby with the new chip. The new chip also supports Quad-channel LPDDR5X RAM at 8,533Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
The APU 780 inside Dimensity 8300 makes it the first chip in its class to support Generative AI with stable diffusion and support for LLM with up to 10 billion parameters. The Imagiq 980 ISP supports up to 320MP camera sensors and 4K video recording at 60fps.
Dimensity 8300 features an integrated 5G modem with support for dual-mode 5G and up to 5.17Gbps downlink on sub-6GHz networks. The chip is alsow equipped with Wi-Fi 6E and Bluetooth 5.4 connectivity.
Xiaomi already confirmed that its Redmi K70E will debut the Dimensity 8300 later this month.