Meizu 16 Plus front panel leaks to reveal ultra-thin bezels

Meizu CEO Jack Wong will announce the next flagship, called Meizu 16, on August 26. There is more than a month until the unveiling of the series, but a Weibo user just showcased the front panel of the Plus-sized variant of the device. The new phone will have practically no bezels on the side and extremely thin top and bottom ones.

The glass panel of the Meizu 16 Plus came from a component factory in China and to get a proper understanding of the size, it was compared with an actual Oppo Find X. The futuristic smartphone with the retractable camera setup is 156.7 mm tall and 74.2 mm wide; looking at the images, the Meizu 16 Plus will likely be no taller than 160 mm and no wider than 76 mm.

These approximate numbers reveal the Meizu 16 Plus will have 6.5” screen, and according to the leakster, it will be an OLED panel. There is only one hole on the top bezel for the selfie camera, although a photo of the opposite side of the glass reveals there is also a proximity sensor and LED notification light.

Meizu 16 Plus front panel on top of Oppo Find X

The Meizu 16 series is expected to have at least one version with an under-display fingerprint scanner or at least a pressure-sensitive mBack button. There will also be a Snapdragon 845 chipset and a vapor chamber for cooling.

Price is expected to be lower than CNY4,000, which at current rates is equal to $600/€510.

Source (in Chinese)