Realme GT Neo design revealed ahead of March 31 announcement, 64MP triple camera confirmed

Sagar, 25 March 2021

Realme has revealed the design of the GT Neo that will be introduced on March 31 in China with the Dimensity 1200 SoC. As you can see, the smartphone has a rectangular camera island on the back, which includes three shooters, with the primary unit using a 64MP sensor.

The camera island is aligned with the shiny stripe that stretches across the rear panel's length and has the Realme logo placed on it with the "Dare To Leap" text. Realme calls this a "Box Logo" design and says it is a tribute to the Cyberpunk culture since that's the source of the design's inspiration.

Realme GT Neo with 64MP triple camera and Box Logo Realme GT Neo with 64MP triple camera and Box Logo
Realme GT Neo with 64MP triple camera and Box Logo

This particular color model we are looking at is named Final Fantasy (machine translated from Chinese), and its back cover adopts a micron-level matte process, which is both rigid and soft and resistant to smudges, according to Realme.

The GT Neo has the power key on its right-side frame and the volume rocker on the left. At the bottom is the USB-C port flanked by a speaker, microphone, and a 3.5mm headphone jack. We don't see a fingerprint reader on the phone's back or sides, meaning it's likely embedded to the screen, confirming an AMOLED panel.

Realme hasn't detailed the rest of the GT Neo's specs yet, but the company previously confirmed it will feature 4D Vibrations and a 3D tempered liquid cooling system consisting of stainless steel and copper to reduce the GT Neo's temperature by up to 15° C.

Realme GT Neo will come with 4D Vibrations and a 3D tempered liquid cooling system Realme GT Neo will come with 4D Vibrations and a 3D tempered liquid cooling system
Realme GT Neo will come with 4D Vibrations and a 3D tempered liquid cooling system

We are still six days away from the unveiling, so expect to see Realme confirm more features of the GT Neo to build hype around it.

Source (in Chinese) | Via


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Reader comments

  • MrDong
  • 26 Mar 2021
  • xZI

Passive cooling on a phone is not going to make a huge difference, rather too much passive cooling nechanisms may instead act as an insulator and provides little benefit, like putting too much thermal paste above a PC CPU. I have heard several report...

  • Anonymous
  • 26 Mar 2021
  • sEF

LOL, SD888 need SERIOUS cooling; not only THICC cooper, it also need liquid cooling and thermal paste, and A.LOT.OF.THEM. As of now, no OEM shown to be successful 'reigning' SD888's heat. And u expect the 'super cheap'...

  • Anonymous
  • 25 Mar 2021
  • ixd

I am not a fanboy of any product my friend. If you want proofs, just search in google you will find what you need and even more. Using specific "techniques" for higher scores is not something new.

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