Redmi Note 8 Pro teardown shows a heat pipe for the Helio G90T chipset

The Xiaomi Redmi Note 8 Pro is not just the first phone with a 64MP camera, it’s Xiaomi’s first quad camera phone. There’s more – this is the first phone to use MediaTek’s gaming-focused Helio G90T chipset. Official teardown images offer a close look at all those components.

The G90T chipset isn’t left to fend for itself, it has a copper heat pipe that connects it to the aluminum chassis of the phone to spread out the heat. You can also see the LPDDR4x RAM stacked on top of the UFS 2.1 storage.

There are a few more MediaTek chipsets here, but charging is handled by a Qualcomm chip that enables QuickCharge 4.0+. The chipset itself supports MediaTek's PumpExpress 4.0. Both of QC4.0+ and PE4.0 are compatible with USB Power Delivery to boot.

Helio G90T chipset with UFS 2.1 storage • Heat pipe to keep it cool (also: antenna placement)

The 64MP camera module is paired up with the 2MP depth sensor. The 8MP ultra wide cam and the macro cam are separate units. An extra detail here is that the glass cover for the quad camera also houses the fingerprint reader.

Rear quad camera and selfie cam • The fingerprint reader

If you go back to the second image on the first row, you’ll see the antenna placement. There are two 2G/3G/4G antennas, one on top and one on the bottom, then there are a couple of Wi-Fi antennas. Of interest are the four corners (in green), which are there to reinforce the phone in case of a drop.

Source