The 10 nm Kirin 970 appears before its official launch with 1.2 Gbps LTE

Yordan, 01 September 2017

Huawei has prepared us for a chip announcement at IFA, and now we know what that sassy tweet was about. The company will introduce its in-house chipset Kirin 970, developed by HiSilicon and built by the 10 nm process by TSMC.

Although Huawei is about to reveal the Kirin 970 on September 2, all the info was already leaked by Roland Quandt on Twitter. The chipset will have 5.5 billion transistors, 8 CPU cores with a maximum frequency of 2.4 GHz, and 12 GPU cores. Huawei also implemented an innovative HiAI mobile computing architecture for better AI performance.

The LTE modem supports the impressive Cat18 connection with up to 1,2 Gbps speeds. These technologies are firsts for mobile chipsets, and they are probably going to appear as early as October 16 when the Huawei Mate 10 is going to be announced.

Via

Huawei Android

Reader comments

Anonymous
04 Sep 2017
UD{

Its Huawei who's at fault for that, the lesser the value they sell their phones to the carriers in return the carriers advertise it more. Or Huawei could provide a bigger marketing budget for that region.

Anonymous
03 Sep 2017
yVI

in which parallel universe ? :)))))

AnonD-558092
02 Sep 2017
r7b

Canada. And they made a really big deal with all carriers to push the P10 duo, but they weren't advertised enough. It was on a few billboards and on the journal for only a week or so, and all interest in the device faded. Right now carriers use the i...