Meizu 16 will incorporate a vapor chamber cooling for the SD845

Ro, 20 June 2018

Another day, another Meizu 16 tease from the company's founder himself. This one is about comfort and performance and the Meziu 16 will try to tackle this with a heat-dispersing heatsink/vapor chamber for the all-powerful Snapdragon 845.

Meizu's founder, Jack Wong, has previously stated that the Meizu 15 is the company's way of trying untested waters while the Meizu 16 will be a significantly more advanced flagship that will take advantage of the Snapdragon 845. However, the previous report claims that the Meizu 16 will come in two variants - a regular one and a plus-sized version. The latter will come with the Snapdragon 845 while the former will have to settle for the Snapdragon 710.

What's interesting, though, is that bigger model with SD845 will feature a copper heat pipe that will help the handset take full advantage of the SoC while keeping it cool and more comfortable to hold during long gaming sessions. It's not the first time we've seen vapor chamber being used in a smartphone - the Galaxy S7 and S7 edge had one of those and more recently, the Razer Phone.

Meizu 15

Anyway, the Meziu 16 shapes up to be an impressive flagship device with high screen-to-body ratio and under display fingerprint, so we can't wait for it to launch during the second half of this year.

Via (in Chinese)


Reader comments

  • Kangal
  • 21 Jun 2018
  • uCX

Copper Pipe =/= Vapour Chamber. Whilst I can see *some * utility for using copper for heat management in a powerful SoC in a small phone, I don't quite see it for tablets. Whereas a full-blown Vapour Chamber is blown out of proportions. It's lik...

Go go go Meizu!

  • Anonymous
  • 21 Jun 2018
  • YMn

Microsoft Lumia 950 was the first to bring a vapour chamber in smartphone

Popular articles


Popular devices

Electric Vehicles