Motorola Moto X next-gen to feature a heat pipe for cooling
- t
- the tech nerd
- U$0
- 23 Dec 2015
well they can now claim that device doesn't heat at all if synapses 820 doesn't heat
- ?
- Anonymous
- Ibx
- 23 Dec 2015
Maybe the heat pipe is useful in a device with a plastic or glass back. In the end, it didn't seem like it did that much in the Xperia devices. To me this sort of design, without the attached heat sink and fan, like in laptops, doesn't make that much sense. How much can it really do?
People should look at AnandTech's review of the Nexus 6P that just came out. They said by far in their testing (and no one does as technical and careful tests as them) the 6P does the best job dissipating the heat from the 810 chipset. The 6P does this by using a little thermal paste for good heat conductivity off of the chipset and then using the aluminum unibody as a giant heatsink.
So as the end of the day, the heat pipe, I think, is not a magical solution to this problem. There are better designs. And of course, hopefull the 820 will be more thermally efficient anyway.
- ?
- Anonymous
- Ibx
- 23 Dec 2015
AnonD-411799, 22 Dec 2015but were's the flagship resting?Copying is what that part of world do so well.
- V
- Vash
- RHT
- 23 Dec 2015
DarkReed, 22 Dec 2015Bulgy PhonesSo you want a big, heavy and noisy phone right!?!? =P
- ?
- Anonymous
- T25
- 23 Dec 2015
To anyone saying this is copying.
No, it's employing a hardware cooling technique used for ages. Only the sort of dimwit that thinks Apple's 'rectangle with round corners' is a valid patent would think this is "copying"...
- N
- NechPech
- 9LB
- 22 Dec 2015
AnonD-411799, 22 Dec 2015samsung chip is used by samsung itself. they dont provide f... moreThe Meizu PRO 5 released in Oct, '15 uses the Exynos 7420 chip by Samsung.
- D
- AnonD-375713
- Pkp
- 22 Dec 2015
AnonD-411799, 22 Dec 2015were does it take away? will we be seeing the vents too then?spreads trough the body, so dissipates heat better.
Passive cooling only.
Also people please don't say that Lumia 950 use watercooling, vapor chamber/phase change cooling systems aren't the same as watercooling.
Watercooling forces the water to flow, phase change systems rely on convection alone.
Granted this is just a conceptual difference, but still this is the case.
- D
- AnonD-411799
- 2SS
- 22 Dec 2015
Anonymous, 22 Dec 2015Copy of Sony's flagship design. but were's the flagship resting?
- ?
- Anonymous
- Ibx
- 22 Dec 2015
Copy of Sony's flagship design.
- D
- AnonD-411799
- 2SS
- 22 Dec 2015
Dave Granger, 22 Dec 2015Why don't they just use a Samsung chip instead?samsung chip is used by samsung itself. they dont provide for others(i dont know). well they manufacture for others btw. like apple's chip but the design is from apple.
- D
- AnonD-411799
- 2SS
- 22 Dec 2015
mir, 22 Dec 2015Its just a heat pipe. Its not filled with water. The only f... morewere does it take away? will we be seeing the vents too then?
- z
- za_lucky89
- sp0
- 22 Dec 2015
sony has a heat pipe since Z3
- D
- Dave Granger
- nxy
- 22 Dec 2015
Why don't they just use a Samsung chip instead?
- m
- mir
- thh
- 22 Dec 2015
tanvir, 22 Dec 2015so Motorola wants to copy the idea of water cooling system ... moreIts just a heat pipe. Its not filled with water. The only function of this is to draw heat away from the processor.
- t
- tanvir
- XQh
- 22 Dec 2015
so Motorola wants to copy the idea of water cooling system from Microsoft which is available in Lumia 950xl
- ?
- Anonymous
- Ibx
- 22 Dec 2015
Copy of Sony Xperia design,,,
that's what that part of world does.
- ?
- Anonymous
- 3aK
- 22 Dec 2015
Anonymous, 22 Dec 2015#@$% is getting weird with these Qualcomm smartphones..Lets... moreNo thanks. I'd like to actually do stuff with my processing power not be locked in the iJail.
- D
- AnonD-194758
- 0Zq
- 22 Dec 2015
Some people say they want water-cooled devices, so...I'll say I want an intercooler device! :P
- jrharbort
- jQc
- 22 Dec 2015
AnonD-411799, 22 Dec 2015you require fan to blow the heat out. so this is going to f... moreThe heat pipe helps spread the heat across a greater surface area much faster. This is known as passive cooling. This is nothing new, and should substantially increase the cooling capability of the chipset.
- a
- adrianf
- nC6
- 22 Dec 2015
It would still need a quite large surface area to dissipate that heat. They might as well use aluminum materials for the majority of the device for cooling.