vivo X70 Pro+ leaks point to impressive camera setup, Snapdragon 888+
The vivo X70 series will arrive on September 9. The mightiest phone of the family will be the vivo X70 Pro+ which was already teased yesterday, and today a leakster revealed the full camera setup. The shooters, developed alongside Zeiss, will include a 50MP 1/1.31" main snapper and a periscope lens.
The main camera will have a Samsung ISOCELL GN1 sensor. The ultra-wide-angle snapper will come with Sony IMX598 48MP sensor behind, while the third cam will be a dedicated shooter for portraits. Its sensor will be 12MP Sony IMX663 and will offer 2x magnification.
The periscope cam will have an 8MP sensor and will support 5x zoom. Three of the four shooters will also support OIS for video stabilization, with only the ultra-wide-angle shooter missing it.
The new flagship is expected to run on Snapdragon 888+ chipset, and its appearance on Geekbench suggests the same. It was tested with its V2145A model name on the benchmarking platform and scored 1156 with a single core and 3460 with multiple cores.
The vivo X70 Pro+ will arrive in Leather Orange and Leather Blue colors, but customers will also be able to purchase the device in Black color. It will be the only device in the lineup with leather back panels, the vivo X70 and vivo X70 Pro will have up to four paint jobs, all of them with a glass back.
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Reader comments
- Dudenoway
- 01 Sep 2021
- 6p{
Ok so if we talk about pixel size vs res. Then res is more important. For example. Do u think a 1.8 micron sensor will take better or a hmx sensor with 27mp binned will take better photos? And pixel size is literally pixel size. It has nothing to do ...
- CK
- 01 Sep 2021
- IWY
This will be the first phone in the recent age to equip CZ glass lens.
- EG3Po
- 01 Sep 2021
- SmE
We were talking about pixel size vs resolution so sure if you want to expand the topic you can go into several other stuff like lens type, quality, coating, number of elements etc etc. I agree that sensor size is the key as well as processing. ...